Details
AMD Ryzen 9 7900X3D 12-Core 24-Thread 5.6GHz AM5 Tray Processor The AMD Ryzen 9 7900X3D is a powerhouse processor designed for gamers, creators, and enthusiasts who demand the best in performance and efficiency. Packed with advanced features like AMD's revolutionary 3D V-Cache technology and support for the latest standards, this processor delivers unmatched performance for intensive workloads and next-level gaming experiences. Specifications Breakdown: 1. 12 Cores and 24 Threads: The Ryzen 9 7900X3D is equipped with 12 powerful cores and 24 threads, making it ideal for multitasking, gaming, and demanding creative applications like video editing, 3D rendering, and AI workloads. The simultaneous multithreading (SMT) technology ensures every core can handle multiple tasks efficiently, providing a seamless experience even under heavy loads. 2. Base Clock: 4.4 GHz With a base clock speed of 4.4 GHz, this processor delivers fast and reliable performance right out of the box, ensuring quick responses and high processing power for day-to-day tasks and applications. 3. Max Boost Clock: Up to 5.6 GHz For demanding workloads or intensive gaming, the processor can boost up to 5.6 GHz, ensuring exceptional speed and smooth performance. This high boost clock is perfect for situations where quick bursts of power are required, such as competitive gaming or large data processing tasks. 4. Cache: 144 MB Total (L2 + L3) This processor comes with a massive 144 MB of combined cache, including the revolutionary 3D V-Cache. This large cache size minimizes latency, significantly enhancing gaming performance and speeding up data-intensive tasks, making it perfect for high-performance computing environments. 5. Socket Compatibility: AM5 Designed for the latest AM5 socket, this processor supports advanced features like PCIe 5.0 and DDR5 memory, ensuring you have access to cutting-edge technology. The AM5 platform also offers better power delivery, making it more efficient and future-ready for upcoming innovations. 6. Thermal Design Power (TDP): 120W With a TDP of 120W, the Ryzen 9 7900X3D strikes a balance between high performance and efficient power consumption. It’s recommended to pair this processor with a high-quality cooling solution to maintain optimal temperatures during intensive workloads. 7. Weight: 79 Grams The processor weighs 79 grams, making it compact and easy to handle during installation. Its lightweight design doesn’t compromise performance, ensuring reliability and durability. 8. Dimensions: 1.6 x 1.6 x 0.24 inches (approx.) Its compact size makes it compatible with most modern motherboard designs, ensuring seamless integration into your PC build without requiring additional space. 9. PCIe 5.0 and DDR5 Support: The Ryzen 9 7900X3D supports PCIe 5.0, delivering twice the bandwidth of PCIe 4.0 for faster storage and GPU performance. The inclusion of DDR5 memory compatibility allows users to take advantage of next-gen RAM for faster data transfer and improved multitasking capabilities. 10. 3D V-Cache Technology: This groundbreaking feature stacks additional cache memory vertically on the chip, increasing capacity without expanding the die size. This innovation dramatically boosts gaming performance, reducing latency, and improving frame rates in modern titles. Whether you're a gamer looking for top-tier performance or a creator seeking the ultimate in processing power, the AMD Ryzen 9 7900X3D sets a new standard for desktop processors. With its advanced features and cutting-edge design, it’s the perfect choice for enthusiasts who want to push their systems to the limit.
More Information
GTIN | 730143314916 |
---|---|
Weight | 0.200000 |
Color | Grey |
Manufacturer | AMD |
Dimensions | 1.6 x 1.6 x 0.24 inches |
Form Factor | Desktops , Boxed Processor |
Total Cores | 12 |
Total Threads | 24 |
Total L2 Cache | 12 MB |
Architecture | Zen 4 |
Max. Boost Clock | Up to 5.6 GHz |
Base Clock | 4.4 GHz |
L1 Cache | 768 KB |
L3 Cache | 128 MB |
Processor Technology for CPU Cores | TSMC 5nm FinFET |
Processor Technology for I/O Die | TSMC 6nm FinFET |
CPU Compute Die (CCD) Size | 71mm² |
I/O Die (IOD) Size | 122mm² |
Package Die Count | 3 |
Supporting Chipsets | A620 , X670E , X670 , B650E , B650 , X870E , X870 , B840 , B850 |
CPU Boost Technology | Precision Boost 2 |
Instruction Set | x86-64 |
Supported Extensions | AES , AMD-V , AVX , AVX2 , AVX512 , FMA3 , MMX-plus , SHA , SSE , SSE2 , SSE3 , SSE4.1 , SSE4.2 , SSE4A , SSSE3 , x86-64 |
Recommended Cooler | Liquid cooler recommended for optimal performance |
Max. Operating Temperature (Tjmax) | 89°C |
OS Support | Windows 11 - 64-Bit Edition , Windows 10 - 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit |
Graphics Core Count | 2 |
Graphics Frequency | 2200 MHz |
Supported Technologies | AMD EXPO™ Technology , AMD Ryzen Technologies |
Reviews
Write Your Own Review